12 companies filed H-1B applications for ENGINEER, PRINCIPAL - FIRMWARE roles (FY2026), ranked by filing volume from U.S. Department of Labor disclosure data.
| # | Employer | H-1B filings | Avg. wage |
|---|---|---|---|
| 1 | Broadcom Corporation | 36 | $129,543 |
| 2 | Microchip Technology Inc. | 12 | $130,048 |
| 3 | CALAMP WIRELESS NETWORKS CORPORATION | 4 | $127,983 |
| 4 | SK HYNIX MEMORY SOLUTIONS AMERICA INC. | 4 | $180,626 |
| 5 | SK HYNIX MEMORY SOLUTIONS INC. | 4 | $168,536 |
| 6 | Samsung Semiconductor, Inc. | 2 | $236,257 |
| 7 | XIOTECH CORPORATION | 1 | $99,000 |
| 8 | CYPRESS SEMICONDUCTOR CORPORATION | 1 | $164,676 |
| 9 | ENVERV, INC. | 1 | $150,000 |
| 10 | INFINEON TECHNOLOGIES AMERICAS CORP. | 1 | $233,394 |
| 11 | Micron Technology, Inc. | 1 | $216,871 |
| 12 | WESTERN DIGITAL TECHNOLOGIES, INC. | 1 | $92,000 |
| State | H-1B filings |
|---|---|
| California | 51 |
| New Jersey | 5 |
| Minnesota | 4 |
| Colorado | 3 |
| Massachusetts | 2 |
Counts are H-1B Labor Condition Applications (LCAs) from public U.S. Department of Labor disclosure data, whatever their outcome (certified, denied or withdrawn). Wages shown are the offered annual wage on the filing, not a guarantee of pay.