Top H-1B Sponsors for Firmware Engineering

Priority dates, work visas, and labor market data

Top H-1B Sponsors for Firmware Engineering

21 companies filed certified H-1B applications for Firmware Engineering roles (FY2026), ranked by filing volume from U.S. Department of Labor disclosure data.

H-1B filings
71
for this role
Sponsoring employers
21
distinct companies
Median H-1B wage
$175,000
$134,894–$204,127 middle 50%

Top H-1B sponsors for Firmware Engineering

# Employer H-1B filings Avg. wage
1 Microsoft Corporation 49 $191,147
2 Parabit Systems Inc 2 $95,000
3 SONNEN INC. 2 $75,000
4 APPLE INC. 1 $200,000
5 LANDIS+GYR 1 $130,000
6 TALIS BIOMEDICAL CORPORATION 1 $183,276
7 SK HYNIX MEMORY SOLUTIONS INC. 1 $125,800
8 Google LLC 1 $212,000
9 VARENTEC, INC 1 $70,000
10 Master Compliance 1 $90,000
11 LIFE360, INC. 1 $267,540
12 Acuity Brands Technology, Inc. 1 $69,909
13 MINDLANCE, INC 1 $91,000
14 BRIDGELUX, INC. 1 $90,000
15 Infinera Corporation 1 $98,410
16 PIN TECHNOLOGY, INC. 1 $100,027
17 GOPRO INC. 1 $227,885
18 TenaFe, Inc. 1 $102,710
19 TESLA MOTORS, INC. 1 $80,000
20 Xenios Corp 1 $96,138
21 Silicon Laboratories Inc. 1 $133,099

Where H-1B Firmware Engineering jobs are filed

StateH-1B filings
California35
Washington21
Texas6
Georgia4
New York2

Frequently asked questions

Which companies sponsor H-1B visas for Firmware Engineering?
21 employers filed certified H-1B labor condition applications for Firmware Engineering roles (FY2026). The top sponsors by filing volume include Microsoft Corporation, Parabit Systems Inc, SONNEN INC.. The full ranked list is below.
What do H-1B Firmware Engineering jobs pay?
The median certified H-1B wage for Firmware Engineering roles is $175,000. The middle 50% of offers fall between $134,894 and $204,127.
Where are H-1B Firmware Engineering jobs located?
Most H-1B Firmware Engineering filings are concentrated in California, Washington, Texas.
How is this ranking calculated?
Employers are ranked by the number of certified H-1B Labor Condition Applications (LCAs) they filed for Firmware Engineering roles, sourced from U.S. Department of Labor public disclosure data. This page reflects 71 H-1B filings for the role.

Counts are certified H-1B Labor Condition Applications (LCAs) from public U.S. Department of Labor disclosure data. Wages shown are the offered annual wage on the filing, not a guarantee of pay.