H-1B & Green Card Sponsorship Data
Source: US Dept of Labor. Represents Base Salary only. Excludes RSUs, signing bonuses, and variable compensation. View All Salary RecordsTotal Filings
2021-PresentApproval Rate
Certified CasesMedian Salary
Across All RolesFiling Growth
16 → 40 filings, FY2021 to FY2025 (latest year appears partial)| Program | Last Filing | Dated filings (2021–Present) |
|---|---|---|
| H-1B | Jun 10, 2026 | 144 |
| PERM | Sep 28, 2023 | 15 |
| E-3 | Jun 30, 2021 | 1 |
| Role | Last Filing | Dated filings (2021–Present) |
|---|---|---|
| Manager, Photo Process Development | Jun 10, 2026 | 1 |
| Sr Thin Film Process Dev Engineer | Jun 1, 2026 | 3 |
| SENIOR PROCESS DEVELOPMENT ENGINEER | May 20, 2026 | 1 |
| HAMR Design Engineer | May 18, 2026 | 2 |
| PLATING PROCESS DEV ENGINEER | Apr 6, 2026 | 3 |
| Role | Count | Median Salary | Min | Max |
|---|---|---|---|---|
| CMP PROCESS DEVELOPMENT ENGINEER | 9 | $115,003 | $108,014 | $161,006 |
| MATERIALS SCIENTIST | 9 | $140,005 | $105,019 | $168,510 |
| PHOTOLITHOGRAPHY MANUFACTURING ENGINEER | 9 | $155,169 | $87,506 | $172,000 |
| Photolithography Process Development Engineer | 9 | $140,005 | $114,192 | $190,000 |
| PROCESS DEVELOPMENT ENGINEER | 7 | $113,734 | $94,536 | $140,005 |
| INTEGRATION ENGINEER | 6 | $147,003 | $119,995 | $170,000 |
| PLATING MANUFACTURING ENGINEER | 6 | $148,005 | $140,005 | $170,000 |
| Plating Process Development Engineer | 6 | $148,510 | $119,870 | $157,393 |
| Thin Film Manufacturing Engineer | 6 | $142,002 | $94,536 | $150,010 |
| CMP Manufacturing Engineer | 5 | $125,853 | $110,011 | $150,000 |
| Fiscal Year | Filings | Median Salary | Approval Rate |
|---|---|---|---|
| 2021 | 16 | $107,514 | 87.5% |
| 2022 | 18 | $111,991 | 88.9% |
| 2023 | 29 | $135,013 | 89.7% |
| 2024 | 26 | $133,183 | 96.2% |
| 2025 | 40 | $154,503 | 92.5% |
| 2026 | 31 | $155,169 | 100.0% |
| Program | Median Days | Avg Days | P25–P75 | Cases |
|---|---|---|---|---|
| H-1B | 7 | 49 | 7–7 | 144 |
| PERM | 370 | 315 | 184–421 | 15 |