H-1B & Green Card Salary Data and Market Analysis
Total Filings
All time (charts below use selected years)Median Salary
Across filings in selected periodTop Employers
Hiring This RoleSee all H-1B/PERM filings for this role →
| Employer | Filings | Median Salary | Salary Range | Approval Rate |
|---|---|---|---|---|
| ALLEGRO MICROSYSTEMS INC | 4 | $76,782 | $56,056 - $84,357 | 100.0% |
| City | State | Filings | Median Salary |
|---|---|---|---|
| WORCESTER | MA | 4 | $76,782 |
These roles are variations of MICROELECTRONICS PACKAGING AND ASSEMBLY ENGINEER with different seniority levels.
| Role | Experience Level | Filings | Avg Salary |
|---|---|---|---|
| MICROELECTRONICS PACKAGING AND ASSEMBLY ENGINEER | Unspecified | 4 | $73,494 |
| Fiscal Year | Filings | Median Salary | Approval Rate |
|---|---|---|---|
| 2012 | 1 | $56,056 | 100.0% |
| 2014 | 1 | $73,778 | 100.0% |
| 2016 | 1 | $79,785 | 100.0% |
| 2017 | 1 | $84,357 | 100.0% |
Compare how top companies pay for this role.
| Company | Filings | Median Salary | Approval Rate |
|---|---|---|---|
| ALLEGRO MICROSYSTEMS INC | 4 | $76,782 | 100.0% |