U.S. Immigration Data

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DEVICE CHARACTERIZATION ENGINEER salaries

18 H-1B & PERM records for "DEVICE CHARACTERIZATION ENGINEER", sourced from U.S. Department of Labor disclosures.

Looking for green-card wait times instead? See EB-1, EB-2 & EB-3 priority dates by country.

Search H-1B & Green Card Salary Data

Source: US Dept of Labor. Represents Base Salary only. Excludes RSUs, signing bonuses, and variable compensation.

18

Results Found

$105755

Average Salary

$73091

Minimum

$216382

Maximum

Active filters: Job: DEVICE CHARACTERIZATION ENGINEER
Employer Role Location Salary Program Filing Date
QUALCOMM ATHEROS, INC. *Director of Bench Test Dev. and Device Character… SAN JOSE, CA $216382 - $261800 Green Card Nov 2, 2016
Micron Technology, Inc. R&D Device Characterization Engineer Boise, ID $120652 H-1B May 16, 2023
Micron Technology, Inc. R & D Electrical Device Characterization Engineer Boise, ID $120000 H-1B May 12, 2025
IceMOS Technology Corporation TCAD Simulation & Device Characterization Engineer Tempe, AZ $119000 H-1B Aug 10, 2023
IceMOS Technology Corporation TCAD Simulation & Device Characterization Engineer Tempe, AZ $119000 H-1B Aug 5, 2023
APTINA LLC DEVICE CHARACTERIZATION ENGINEER SAN JOSE, CA $112000 H-1B Aug 31, 2011
ANALOG DEVICES, INC. DEVICE CHARACTERIZATION ENGINEER WILMINGTON, MA $106649 - $131700 H-1B Mar 29, 2012
ANALOG DEVICES, INC. IC DEVICE CHARACTERIZATION ENGINEER WILMINGTON, MA $106644 - $144000 H-1B Sep 13, 2016
Micron Technology, Inc. R&D Device Characterization Engineer Boise, ID $105252 H-1B Mar 19, 2024
Micron Technology, Inc. R&D Device Characterization Engineer $101988 Green Card Oct 2, 2024
Micron Technology Utah, LLC Device Characterization Engineer Lehi, UT $100030 H-1B May 14, 2020
Micron Technology, Inc. R&D Device Characterization Engineer Boise, ID $91605 H-1B Mar 15, 2021
MICRON TECHNOLOGY, INC. DEVICE CHARACTERIZATION ENGINEER BOISE, ID $89352 H-1B Jul 7, 2017
MICRON TECHNOLOGY, INC. R&D DEVICE CHARACTERIZATION ENGINEER BOISE, ID $85000 H-1B Nov 4, 2010
MICRON TECHNOLOGY, INC. Device Characterization Engineer BOISE, ID $80000 Green Card Jul 2, 2016
SEMATECH, INC MEMORY DEVICE CHARACTERIZATION ENGINEER ALBANY, NY $80000 H-1B Mar 1, 2011
IBM CORPORATION 14NM DEVICE CHARACTERIZATION ENGINEER HOPEWELL JUNCTION, NY $76939 - $140000 H-1B Nov 22, 2013
IBM CORPORATION ADVISORY DEVICE CHARACTERIZATION ENGINEER HOPEWELL JUNCTION, NY $73091 - $134072 H-1B Jun 4, 2010
About This Data
Data Source

This data comes from the U.S. Department of Labor's public disclosure files for H-1B (temporary work visa) and green card (PERM labor certification) applications.

What You Can Find
  • H-1B Salaries: Wages offered to H-1B specialty occupation workers
  • Green Card Salaries: Wages offered for green card sponsorship (PERM) positions
  • Employer Information: Which companies sponsor most workers
  • Location Data: Salary differences by state and city
How to Use This Data
  • Research salaries for your role at specific companies
  • Compare offers across different locations
  • Look up the green card (PERM) wage level for a role and employer
  • Understand market rates for salary negotiations
Note: This data shows wages from official DOL filings. Actual compensation may include additional benefits, bonuses, and equity not reflected here.
Cite or link to this database

This is a free, public reference built from official U.S. Department of Labor disclosure files (1.5M+ H-1B and PERM records). Writers, forums, and resource lists are welcome to link to it — no permission needed.