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Package Design Engineer salaries

22 H-1B & PERM records for "Package Design Engineer", sourced from U.S. Department of Labor disclosures.

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Source: US Dept of Labor. Represents Base Salary only. Excludes RSUs, signing bonuses, and variable compensation.
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22

Results Found

$110864

Average Salary

$60000

Minimum

$202000

Maximum

Active filters: Job: Package Design Engineer
Employer Role Location Salary Program Filing Date
Facebook, Inc. Silicon Package Design Engineer Menlo Park, CA $202000 H-1B Jan 27, 2020
Renesas Electronics America Inc. Sr. Manager, Package Design Engineering San Jose, CA $188226 H-1B Mar 20, 2024
Meta Platforms, Inc. Silicon Package Design Engineer Seattle, WA $188000 H-1B Aug 5, 2022
Chipletz Inc. Advanced IC Package Design Engineer Bee Cave, TX $170000 H-1B Jun 14, 2024
Astera Labs INC Senior Package Design Engineer San Jose, CA $151953 - $190000 H-1B Sep 15, 2025
Apple Inc. IC Package Design Engineer Santa Clara, CA $147400 - $220900 H-1B Jan 17, 2026
Apple Inc. IC Package Design Engineer Santa Clara, CA $147400 - $220900 H-1B Mar 18, 2026
APPLE INC. IC Package Design Engineer Cupertino, CA $131000 - $196500 Green Card Mar 17, 2023
SiTime Corporation Package Design Engineer $115000 - $125000 Green Card Aug 1, 2023
SiTime Corporation Package Design Engineer Santa Clara, CA $115000 H-1B May 6, 2022
ALTERA CORPORATION PACKAGE DESIGN ENGINEER, ADVANCED (ELECTRICAL ENGI SAN JOSE, CA $84109 H-1B Dec 14, 2009
MICRON TECHNOLOGY, INC. Assembly Package Design Engineer BOISE, ID $81723 Green Card Sep 18, 2015
MICRON TECHNOLOGY, INC. ASSEMBLY PACKAGE DESIGN ENGINEER BOISE, ID $81723 H-1B Mar 9, 2015
KNOWLES ELECTRONICS, LLC PACKAGE DESIGN ENGINEER ITASCA, IL $80000 H-1B Oct 25, 2011
MICRON TECHNOLOGY, INC. ASSEMBLY PACKAGE DESIGN ENGINEER BOISE, ID $73000 H-1B Mar 1, 2012
MICRON TECHNOLOGY, INC. ASSEMBLY PACKAGE DESIGN ENGINEER BOISE, ID $73000 H-1B Feb 21, 2012
Axium Packaging LLC Package Design Engineer New Albany, OH $72000 Green Card Aug 2, 2022
Axium Packaging LLC Package Design Engineer New Albany, OH $72000 Green Card Dec 31, 2020
Axium Packaging LLC Package Design Engineer New Albany, OH $72000 Green Card Dec 30, 2020
KNOWLES ELECTRONICS, LLC PACKAGE DESIGN ENGINEER ITASCA, IL $67580 - $101369 H-1B Aug 14, 2013
SIGNETICS HIGH TECHNOLOGY USA, INC. Semiconductor Package Design Engineer NEWARK, CA $65894 Green Card Sep 1, 2017
CHINA CUSTOM MANUFACTURING, LTD. FOOD PACKAGE DESIGN ENGINEER FREMONT, CA $60000 H-1B Mar 18, 2014
Showing 1-22 of 22 results
About This Data
Data Source

This data comes from the U.S. Department of Labor's public disclosure files for H-1B (temporary work visa) and green card (PERM labor certification) applications.

What You Can Find
  • H-1B Salaries: Wages offered to H-1B specialty occupation workers
  • Green Card Salaries: Wages offered for green card sponsorship (PERM) positions
  • Employer Information: Which companies sponsor most workers
  • Location Data: Salary differences by state and city
How to Use This Data
  • Research salaries for your role at specific companies
  • Compare offers across different locations
  • Look up the green card (PERM) wage level for a role and employer
  • Understand market rates for salary negotiations
Note: This data shows wages from official DOL filings. Actual compensation may include additional benefits, bonuses, and equity not reflected here.
Cite or link to this database

This is a free, public reference built from official U.S. Department of Labor disclosure files (10M+ H-1B and PERM records). Writers, forums, and resource lists are welcome to link to it — no permission needed.