Semiconductor Packaging Engineer salaries
14 H-1B & PERM records for "Semiconductor Packaging Engineer", sourced from U.S. Department of Labor disclosures.
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Source: US Dept of Labor. Represents Base Salary only. Excludes RSUs, signing bonuses, and variable compensation.14
Results Found
$133385
Average Salary
$76800
Minimum
$156853
Maximum
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About This Data
Data Source
This data comes from the U.S. Department of Labor's public disclosure files for H-1B (temporary work visa) and green card (PERM labor certification) applications.
What You Can Find
- H-1B Salaries: Wages offered to H-1B specialty occupation workers
- Green Card Salaries: Wages offered for green card sponsorship (PERM) positions
- Employer Information: Which companies sponsor most workers
- Location Data: Salary differences by state and city
How to Use This Data
- Research salaries for your role at specific companies
- Compare offers across different locations
- Look up the certified green card (PERM) wage level for a role and employer
- Understand market rates for salary negotiations
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This is a free, public reference built from official U.S. Department of Labor disclosure files (1.5M+ H-1B and PERM records). Writers, forums, and resource lists are welcome to link to it — no permission needed.
- Canonical URL: https://visa-bulletin.us/salaries/
- Suggested reference: H-1B & PERM Salary Database — visa-bulletin.us (U.S. DOL disclosure data)