H-1B & Green Card Salary Data and Market Analysis
Total Filings
All time (charts below use selected years)Median Salary
Across filings in selected periodTop Employers
Hiring This RoleSee all H-1B/PERM filings for this role →
| Employer | Filings | Median Salary | Salary Range | Approval Rate |
|---|---|---|---|---|
| Micron Technology, Inc. | 4 | $108,069 | $98,036 - $111,138 | 100.0% |
| City | State | Filings | Median Salary |
|---|---|---|---|
| BOISE | ID | 4 | $108,069 |
These roles are variations of ADVANCED PACKAGING R&D DIE STACKING AND DIE ATTACH ENGINEER with different seniority levels.
| Role | Experience Level | Filings | Avg Salary |
|---|---|---|---|
| ADVANCED PACKAGING R&D DIE STACKING AND DIE ATTACH ENGINEER | Unspecified | 3 | $106,771 |
| ADVANCED PACKAGING R&D DIE STACKING AND DIE ATTACH | Unspecified | 1 | $105,000 |
| Fiscal Year | Filings | Median Salary | Approval Rate |
|---|---|---|---|
| 2012 | 1 | $105,000 | 100.0% |
| 2015 | 1 | $111,138 | 100.0% |
| 2016 | 2 | $104,587 | 100.0% |
Compare how top companies pay for this role.
| Company | Filings | Median Salary | Approval Rate |
|---|---|---|---|
| Micron Technology, Inc. | 4 | $108,069 | 100.0% |